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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Octal 3-State Noninverting Buffer/Line Driver/ Line Receiver with LSTTL-Compatible Inputs
High-Performance Silicon-Gate CMOS
The MC54/74HCT244A is identical in pinout to the LS244. This device may be used as a level converter for interfacing TTL or NMOS outputs to High-Speed CMOS inputs. The HCT244A is an octal noninverting buffer line driver line receiver designed to be used with 3-state memory address drivers, clock drivers, and other bus-oriented systems. The device has non-inverted outputs and two active-low output enables. The HCT244A is the noninverting version of the HCT240. See also HCT241. * * * * * * Output Drive Capability: 15 LSTTL Loads TTL NMOS-Compatible Input Levels Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1 A In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 112 FETs or 28 Equivalent Gates
MC54/74HCT244A
J SUFFIX CERAMIC PACKAGE CASE 732-03
1
20
20 1 20 1
N SUFFIX PLASTIC PACKAGE CASE 738-03 DW SUFFIX SOIC PACKAGE CASE 751D-04 SD SUFFIX SSOP PACKAGE CASE 940C-03 DT SUFFIX TSSOP PACKAGE CASE 948E-02
20 1 20 1
ORDERING INFORMATION MC54HCTXXXAJ Ceramic MC74HCTXXXAN Plastic MC74HCTXXXADW SOIC MC74HCTXXXASD SSOP MC74HCTXXXADT TSSOP
LOGIC DIAGRAM PIN ASSIGNMENT
A1 A2 A3 A4 DATA INPUTS B1 B2 B3 B4 11 13 15 17 9 7 5 3 YB1 YB2 YB3 YB4 2 4 6 8 18 16 14 12 YA1 YA2 YA3 YA4 NONINVERTING OUTPUTS ENABLE A A1 YB4 A2 YB3 A3 YB2 A4 YB1 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC ENABLE B YA1 B4 YA2 B3 YA3 B2 YA4 B1
FUNCTION TABLE
Inputs Outputs YA, YB L H Z Enable A, Enable B L L H
1 OUTPUT ENABLE A ENABLES ENABLE B 19
PIN 20 = VCC PIN 10 = GND
A, B L H X
Z = high impedance X = don't care
10/95
(c) Motorola, Inc. 1995
1
REV 6
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* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C Ceramic DIP: - 10 mW/_C from 100_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C SSOP or TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
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MAXIMUM RATINGS*
MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MC54/74HCT244A
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
TL
VOH
tr, tf
Iin
VOL
TA
VIH
VIL
Iin
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC, SSOP or TSSOP Package) (Ceramic DIP)
Storage Temperature
Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package SSOP or TSSOP Package
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time (Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Maximum Input Leakage Current
Maximum Low-Level Output Voltage
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Parameter
Parameter
Parameter
Vin = VIH or VIL |Iout| 6 mA
Vin = VIH or VIL |Iout| 20 A
Vin = VIH or VIL |Iout| 6 mA
Vin = VIH or VIL |Iout| 20 A
Vin = VCC or GND
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v
v
v
v
v
v
Test Conditions
- 0.5 to VCC + 0.5
- 1.5 to VCC + 1.5
- 65 to + 150
2 - 0.5 to + 7 - 55 Min 4.5 Value 0 0 75 35 20 260 300 750 500 450 + 125 VCC Max 500 5.5 VCC V 5.5 4.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 4.5 5.5 Unit Unit mW mA mA mA
_C
_C
_C
ns
V
V
V
V
V
- 55 to 25_C
0.1
0.26
3.98
0.1 0.1
4.4 5.4
0.8 0.8
2 2
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Guaranteed Limit
v 85_C v 125_C
High-Speed CMOS Logic Data DL129 -- Rev 6 1.0 0.33 3.84 0.1 0.1 4.4 5.4 0.8 0.8 2 2
v
1.0 0.4 0.1 0.1 3.7 4.4 5.4 0.8 0.8 2 2
v
Unit
A V V V V
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NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D). NOTES: 1. Information on typical parametric values along with frequency or heavy load considerations can be found in Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D). 2. Total Supply Current = ICC + ICC.
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol ICC ICC IOZ Additional Quiescent Supply Current Maximum Quiescent Supply Current (per Package) Maximum Three-State Leakage Current Parameter Vin = 2.4 V, Any One Input Vin = VCC or GND, Other Inputs lout = 0 A Output in High-Impedance State Vin = VIL or VIH Vout = VCC or GND Vin = VCC or GND Iout = 0 A Test Conditions VCC V 5.5 5.5 5.5 - 55 to 25_C 0.5 -55_C 4 2.9 Guaranteed Limit
High-Speed CMOS Logic Data DL129 -- Rev 6 Symbol OUTPUT YA OR YB tPLH, tPHL tTLH, tTHL tPZL, tPZH tPLZ, tPHZ CPD Cout Cin INPUT A OR B tPLH tr Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 1 and 3) Maximum Propagation Delay, A to YA or B to YB (Figures 1 and 3) tTLH 90% 1.3 V 10% 2.7 V 1.3 V 0.3 V
* Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V 10%, CL = 50 pF, Input tr = tf = 6 ns)
Power Dissipation Capacitance (Per Enabled Output)*
Maximum Three-State Output Capacitance (Output in High-Impedance State)
Maximum Propagation Delay, Output Enable to YA or YB (Figures 2 and 4)
Maximum Propagation Delay, Output Enable to YA or YB (Figures 2 and 4)
Figure 1.
tf
Parameter
tPHL
tTHL
SWITCHING WAVEFORMS
GND
3V
3 OUTPUT Y OUTPUT Y ENABLE A OR B 1.3 V - 55 to 25_C 1.3 V 1.3 V Typical @ 25C, VCC = 5.0 V 15 10 12 22 26 20 tPZH tPZL
Figure 2.
Guaranteed Limit
tPHZ
tPLZ
v 85_C
v 85_C v 125_C
15
10
15
28
33
25
55
5.0
40
MC54/74HCT244A
25_C to 125_C
v 125_C
10%
2.4
90%
10
15
10
18
33
39
30
160
MOTOROLA HIGH IMPEDANCE VOH VOL HIGH IMPEDANCE GND 3V Unit Unit mA A A pF pF pF ns ns ns ns
MC54/74HCT244A
TEST CIRCUITS
TEST POINT OUTPUT DEVICE UNDER TEST DEVICE UNDER TEST TEST POINT OUTPUT 1 k CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH.
CL*
CL*
* Includes all probe and jig capacitance
* Includes all probe and jig capacitance
Figure 3.
Figure 4.
LOGIC DETAIL
TO THREE OTHER A OR B INVERTERS
ONE OF 8 BUFFERS VCC DATA INPUT A OR B YA OR YB
ENABLE A OR ENABLE B
MOTOROLA
4
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HCT244A
OUTLINE DIMENSIONS
J SUFFIX CERAMIC PACKAGE CASE 732-03 ISSUE E
B A F C L
DIM A B C D F G H J K L M N NOTES: 1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE POSITION AT SEATING PLANE, AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS A AND B INCLUDE MENISCUS. MILLIMETERS MIN MAX 23.88 25.15 6.60 7.49 3.81 5.08 0.38 0.56 1.40 1.65 2.54 BSC 0.51 1.27 0.20 0.30 3.18 4.06 7.62 BSC 0_ 15 _ 0.25 1.02 INCHES MIN MAX 0.940 0.990 0.260 0.295 0.150 0.200 0.015 0.022 0.055 0.065 0.100 BSC 0.020 0.050 0.008 0.012 0.125 0.160 0.300 BSC 0_ 15_ 0.010 0.040
20 1
11 10
N H D
SEATING PLANE
G
K
J M
-A-
20 11
N SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE E
B
1
10
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
-T-
SEATING PLANE
K M E G F D
20 PL
N J 0.25 (0.010)
M 20 PL
0.25 (0.010) TA
M
M
TB
M
DIM A B C D E F G J K L M N
-A-
20 11
DW SUFFIX PLASTIC SOIC PACKAGE CASE 751D-04 ISSUE E
10X
-B-
1 10
P 0.010 (0.25)
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029
20X
D
M
0.010 (0.25)
TA
S
B
J
S
F R X 45 _ C -T-
18X SEATING PLANE
G
K
M
High-Speed CMOS Logic Data DL129 -- Rev 6
5
MOTOROLA
MC54/74HCT244A
OUTLINE DIMENSIONS
SD SUFFIX PLASTIC SSOP PACKAGE CASE 940C-03 ISSUE B
20X
K REF 0.12 (0.005)
M
TU
S
V
0.25 (0.010)
S
N M N
L/2 L
PIN 1 IDENT
20
11
B
1 10
F DETAIL E
K
A -V- 0.20 (0.008)
M
-U- J
S
J1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 7.07 7.33 5.20 5.38 1.73 1.99 0.05 0.21 0.63 0.95 0.65 BSC 0.59 0.75 0.09 0.20 0.09 0.16 0.25 0.38 0.25 0.33 7.65 7.90 0_ 8_ INCHES MIN MAX 0.278 0.288 0.205 0.212 0.068 0.078 0.002 0.008 0.024 0.037 0.026 BSC 0.023 0.030 0.003 0.008 0.003 0.006 0.010 0.015 0.010 0.013 0.301 0.311 0_ 8_
TU
SECTION N-N -W-
0.076 (0.003) -T-
SEATING PLANE
C D G H
DETAIL E
20X
K REF
DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948E-02 ISSUE A
M
2X
L/2
20
11
L
PIN 1 IDENT 1 10
B -U-
J J1
N 0.15 (0.006) T U
S
A -V- N F
C D 0.100 (0.004) -T- SEATING
PLANE
G
H
DETAIL E
MOTOROLA
6
IIII IIII IIII IIII
0.15 (0.006) T U
S
0.10 (0.004)
TU
S
V
S
EEE CCC EEE CCC EEE CCC EEE CCC
K1 K K1 DETAIL E
SECTION N-N
0.25 (0.010)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
M
DIM A B C D F G H J J1 K K1 L M
-W-
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HCT244A
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High-Speed CMOS Logic Data DL129 -- Rev 6
CODELINE
*MC54/74HCT244A/D*
7
MC54/74HCT244A/D MOTOROLA


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